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火灾中Cu-Sn合金熔化过程及痕迹特征研究

Melting process and globules’ features of Cu-Sn alloying in fire
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摘要 电弧击穿铜板痕迹是认定接地短路故障引起火灾的关键痕迹之一,但实际现场中,常会发现与之类似的焊锡熔穿铜板的痕迹,干扰调查认定。针对这一问题,利用同步热分析仪对Cu-Sn合金熔化的热力学过程进行分析,参照火灾实际发生场景,研究Cu-Sn合金熔化痕迹形成规律及典型特征。结果表明:O2有助于推进Cu-Sn合金熔化反应;当铜板温度达到515℃时,熔化的Sn将造成铜板熔穿,形成外观与电弧击穿痕迹类似的贯穿熔痕;随着温度升高,Cu-Sn合金熔化处痕迹由金黄色向黑色转变,且贯穿熔痕越来越大。此研究结果对于准确识别接地短路故障,判断现场熔化铜质物品温度,具有一定的理论参考价值。 Mark of melting through copper plate is considered as one of key evidences to show ground short circuit occurring.But some similar melted marks often exist in fire scenes,which may be caused by solder alloying through copper plate.In the paper,the thermodynamic process of Cu-Sn alloy melting was analyzed by simultaneous thermal analyzer.According to actual fire scenario,the formation rule and typical characteristics of Cu-Sn alloy melting mark were researched.The results showed that O2 helped advance the Cu-Sn alloy melting reaction.When the temperature of copper plate was above 515℃,the molten Sn could melt the copper plate and form the melting marks similar to melted marks caused by ground short circuit arc in appearance.As the temperature increased,the melting mark of Cu-Sn alloy changed from gold to black,and the size of alloying marks became larger and larger.This research result has certain theoretical reference value for the accurate identification of ground short circuit and the determination of temperature of molten copper in the field.
作者 林庆文 李阳 何芬芬 杨硕 LIN Qing-wen;LI Yang;HE Fen-fen;YANG Shuo(China People's Police University,Hebei Langfang 065000,China)
出处 《消防科学与技术》 CAS 北大核心 2020年第11期1596-1598,共3页 Fire Science and Technology
基金 国家自然科学基金“电气故障电弧迸溅熔珠引燃机理及痕迹特征形成演化规律”(52074213) 中国人民警察大学创新平台专项项目(2019 sycxpd 001)
关键词 火灾调查 贯穿熔痕 电弧击穿 合金熔化 痕迹特征 fire investigation penetration melted mark arc through melting alloy melting mark characteristics
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