摘要
应用扫描电镜和差示扫描量热仪研究Sb元素(0.25%,0.5%,0.75%,1.0%)对Sn-0.7Cu钎料熔点及钎焊界面的影响。结果表明,Sb元素的加入使钎料的熔点升高,从226.38℃增加到227.09℃,但含量小于0.75%时熔点的变化不大,当Sb元素的含量达到1.0%时变化较大。当Sb元素的含量达到0.5%时,界面化合物的形貌发生了很大变化,扇贝状金属间化合物层变得均匀平滑,避免了大柱状的Cu6Sn5相的生成,厚度也变小,明显地抑制了金属间化合物的生长,细化了晶粒。当Sb元素的含量大于0.5%时,界面又出现大柱状的Cu6Sn5相,且界面化合物层的厚度增大。Sb元素的加入并未改变界面处金属间化合物的种类。
The influences of Sb(0.25%,0.5%,0.75% and 1.0%) on Sn-0.7Cu lead-free solder s melting point and soldering interface was studied by scanning electron microscope and differential scanning calorimetry equipment.The result indicates that the melting point raises from 226.38 ℃ to 227.09 ℃ as Sb was added into the SnCu solders from 0.25% to 1.0%.But the melting point changed a little when Sb is less than 0.75%,only when its content comes up to 1.0% the melting point changed obviously.When SnCu solder contains 0....
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2008年第5期105-108,118,共5页
Transactions of The China Welding Institution
关键词
无铅钎料
熔点
钎焊界面
lead-free solder
melting point
soldering interface
