摘要
在给定的电镀液组分下,对掩模电镀微结构的厚度均匀性及镀层横截面轮廓进行了研究,讨论了影响微结构镀层厚度均匀性的主要因素,分析了镀层横截面轮廓随电流密度的改变而变化的原因。电镀液中无添加剂时,镀层均匀性与阴极极化度及电镀边缘效应直接相关;电镀液中有添加剂时,本实验所使用添加剂所具有的并存吸附状态是影响镀层均匀性的主要因素。通过实验得到可获得良好均匀性镀层的电镀参数为:i=(6±2)mA/cm2,t=25℃。
The thickness uniformity and the cross-sectional profiles of electroplated individual nickel microstructures were investigated in given electroplating conditions.The factors influencing on the thickness uniformity of the microstructures were discussed.Analytical results indicate that the thickness uniformity and the cross-sectional profiles of the microstructures can be controlled through changing the process conditions.When no additives in electroplating solution,the polarizability can explain the changes ...
出处
《光学精密工程》
EI
CAS
CSCD
北大核心
2008年第3期452-458,共7页
Optics and Precision Engineering
基金
国家"863"高技术研究发展计划资助项目(A类)(No.06593NQ070)
中科院创新信息基地资助项目
关键词
掩模电镀
微结构
均匀性
并存吸附状态
through-mask electroplating
microstructure
uniformity
coexisting adsorption state
