摘要
针对无引线镀金表面贴装器件(如CLCC等封装类型器件)的手工智能焊台搪锡技术、手工锡锅搪锡技术、返修工作站搪锡技术进行了介绍和讨论,并比较了三种搪锡技术的性能特点,给出了适合无引线镀金表面贴装器件搪锡的最佳方案。
This paper introduces and discusses the Tin-lining technologies such as handcraft intelligent soldering station technology,handcraft tin pot technology and rework station technology for gold-plated lead-free surface mount devices(for example CLCC devices).The best proposal for Tin-lining of gold-plated lead-free surface mount devices is put forward by comparing the features of these three Tin-lining technologies.
出处
《航天制造技术》
2011年第5期33-35,共3页
Aerospace Manufacturing Technology
关键词
无引线镀金表面贴装器件
搪锡技术
gold-plated lead-free surface mount devices
Tin-lining technology
