摘要
Micro-electro-mechanical systems(MEMS)are being developed as a new multi-disciplinary technology,which will undoubtedly have a revolutionary impact on the future of human life.However,with the development of MEMS technology,the packaging has become the main technical obstacle to the commercialization of MEMS.An approach to MEMS packaging by high-frequency electromagnetic induction heating at wafer level is presented in terms of numerical simulation and experimental study.The structure of inductor is firstly designed and optimized.Then the heating situation of PCB board is verified.The results indicate that the heat impact on the chip during the packaging process can be effectively reduced by local induction heating packaging,therefore the thermal stress on the chip is considerably lowered.This method can effectively improve the reliability of the MEMS devices.
Micro-electro-mechanical systems(MEMS)are being developed as a new multi-disciplinary technology,which will undoubtedly have a revolutionary impact on the future of human life.However,with the development of MEMS technology,the packaging has become the main technical obstacle to the commercialization of MEMS.An approach to MEMS packaging by high-frequency electromagnetic induction heating at wafer level is presented in terms of numerical simulation and experimental study.The structure of inductor is firstly designed and optimized.Then the heating situation of PCB board is verified.The results indicate that the heat impact on the chip during the packaging process can be effectively reduced by local induction heating packaging,therefore the thermal stress on the chip is considerably lowered.This method can effectively improve the reliability of the MEMS devices.
作者
XI YanYan 1,LUO XiaoBing 1,2,LIU WenMing 2,CHEN MingXiang 2 &LIU Sheng 2 1School of Energy and Power Engineering,Huazhong University of Science and Technology,Wuhan 430074,China
2MoEMS Division,Wuhan National Laboratory for Optoelectronics,Huazhong University of Science and Technology,Wuhan 430074,China
基金
supported by the National Hi-Tech Research and Development Program of China("863"Project)(Grant No.2006AA04Z328)
