摘要
文章主要针对埋磁芯多层PCB的制作工艺进行研究,通过嵌入磁芯层压定位技术、磁芯材料同心圆套钻技术、盲埋孔真空树脂塞孔、不对称铜厚分步蚀刻技术,实现了埋入磁芯多层印制板的研发生产;同时满足了客户在阻值、电感、磁芯损耗等方面的特种需求。
This paper mainly showed the technology of production process in multilayer PCB embedded magnetic core. It successfully achieved the product of multilayer PCB embedded magnetic core by using fixation technique of resin filling with vacuum lamination of magnetic core, casing drilling in magnetic core, resin filling of blind hole and separate etching technology for asymmetric line of copper thickness. And it can meet the customer's special requirements on resistance, inductance, and magnetic core loss etc.
出处
《印制电路信息》
2013年第S1期370-374,共5页
Printed Circuit Information
关键词
埋磁芯
磁芯同心圆
真空塞孔
分步蚀刻
Embedded Magnetic Core
Drilling of Magnetic Core
Resin Filling with Vacuum Lamination
Etching Step
