摘要
采用Ag Cu Ti活性钎料箔带分别在880℃/10 min和880℃/60 min两种工艺下对Mg Al2O4陶瓷进行了真空钎焊连接,接头冶金质量良好,两种工艺下接头抗剪强度分别为52.4 MPa和61.3 MPa.微观分析结果表明,靠近陶瓷母材附近生成了连续的扩散反应层结构,结合XRD结果,该层主要由Cu Al2O4和Ti O两种化合物组成;钎缝基体区由Cu(s,s),Ag(s,s)和Ti O相组成.
MgAl2O4 transparent ceramics were vacuum brazed with AgCuTi active filler metal foil under conditions of 880 ℃ /10 min and 880 ℃ /60 min,respectively. The workpieces were metallurgically bonded,and the shear strength of the resultant joints under two conditions was 52. 4 MPa and 61. 3MPa,respectively. The microscopic analysis results show that a consecutive diffusion layer appeared near the ceramics substrate.On the basis of XRD measurement,the layer was mainly composed of CuAl2O4 and TiO phases. The brazed seam consisted of Cu( s,s),Ag( s,s) and TiO Phases.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2015年第4期101-105,118,共6页
Transactions of The China Welding Institution
