摘要
运用Nd:YAG激光在功率300W、光束运动速度为0.05m/s、光束直径为700μm的条件下能得到键合强度平均为9.3MPa的硅/玻璃熔融键合效果。该键合方法能进行选择区域键合,完全避免了由于键合过程中电场给超薄敏感可动微结构带来的畸变甚至失效,为新型室温红外探测器的研制奠定了良好的工艺基础。
A novel bonding method between silicon and glass with Nd: YAG laser is proposed. The suitable bonding condition is that the laser spot's diameter is 700μm, P_L is 300W, and the laser's V_L for bonding is 0.05m/s. The average bonding intension is 9.3MPa. This method can noticeably reduce and eliminate the defects and damage especially in movable and sensitive parts in MEMS, such as thin film of this novel uncooled infrared detector.
出处
《功能材料与器件学报》
CAS
CSCD
2004年第2期236-238,共3页
Journal of Functional Materials and Devices
基金
北京市教委项目(No.KM200310005009)
