摘要
采用局部定域的蒸镍技术能较大幅度地提高镀金层质量差的管座的超声键合强度,使键合强度高于中国军标和美军军标所规定的指标.
This paper introduces that we developed a localization nickelage technique of vacuum deposition. By useing the technique the ultrasonic bonding strength may be improved and the strength will be higher than the required strength of national standard GJB 128-86 and USA MIL-STD-883C for inferior goldplating sockets.
出处
《微电子学与计算机》
CSCD
北大核心
1993年第12期40-42,39,共4页
Microelectronics & Computer
关键词
镀金
管座
键合强度
镀镍
Localization nickelage
Vacuum deposition
Bonding strength
