摘要
现代电子信息技术的发展,推动电子产品向多功能、高性能、高可靠性、小型化、低成本的方向发展,微电子封装、IC设计和IC制造共同构成IC产业的三大支柱。计算机辅助设计(CAD)作为一种重要的技术手段在IC产业中发挥了巨大作用,已广泛应用于电子封装领域。本文结合各个时期电子封装的特点,介绍了封装CAD技术的发展历程,并简要分析了今后发展趋势。
The development of modern electronic information technology promotes electronic product becoming multi-function, high-performance, high-reliability, miniaturization and low-cost. Computer-aided design (CAD) as an important technology has been exerting an important function on IC industry and has been applied to electronic packaging area widey. With the feature of the electronic packaging in different steps, the development of the electronic packaging CAD were discussed and the trend was chiefly analyzed in this paper.
出处
《电子与封装》
2005年第2期5-11,共7页
Electronics & Packaging
关键词
CAD
电子封装
组装
芯片
CAD Electronic Packaging Assembly Chip
