摘要
介绍了SOP集成电路塑料封装模具设计中温度补偿的计算方法和计算结果。封装模具包括上模、下模和附件三大部分,可分成浇注、成型、排气、顶出、复位、加热、温控、上料、预热、定位和支撑等功能系统。
The calculation method and the result of the compensation of the temperature variety in packaging mould design are introduced. The packaging mould consists of three parts: upper half, lower half and accessories. It can be divided into injection, moulding, venting, ejecting, replacing, heating, temperature controlling, lead frame feeding, warm up, placing and supporting system ac- cording to the function.
出处
《半导体技术》
CAS
CSCD
北大核心
2005年第6期45-48,共4页
Semiconductor Technology
基金
国家科技部科技型中小型企业技术创新基金资助(20023101053504)
