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声-振动传感器隔震封装模型模态分析

Modal analyses of the acoustic-vibration sensorsshock isolating packaging models
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摘要 运用振动隔离原理设计声-振动传感器系统中声音传感器的两种隔震封装模型:传统式隔震封装模型和双J形隔震封装模型.运用ANSYS有限元分析软件对模型进行模态分析,得出两种封装模型的固有频率与模型尺寸参数的关系曲线.分析结果表明,双J形隔震封装模型的固有频率明显低于传统的隔震封装模型的固有频率,双J形隔震封装模型尺寸参数为R=1.6mm,r=1.2mm,H=8mm时,其固有频率为:左右振动模式f21=30.900Hz,前后振动模式f22=105.99Hz,上下振动模式f23=130.84Hz. The shock isolating principle has been used to design two packaging models of the acoustic sensor in the acoustic-vibration sensors system. The first model is the traditional type of the shock isolating packaging, and the second model is double J-like shock isolating packaging. The relationship curves between the frequencies of the two models and their scale parameters have been gained through modal analyses by use of the finite element analysis software Ansys. The results show that the natural frequencies of the double J-like model are less than those of the traditional model, when the scale parameters of the double J-like model are: R = 1.6 mm, r = 1.2 mm and H = 8 mm, and its three natural frequencies have been given, f1 = 30.90 Hz, f2 = 105.99 Hz, f3 = 130.84 Hz.
出处 《哈尔滨工业大学学报》 EI CAS CSCD 北大核心 2005年第7期983-985,共3页 Journal of Harbin Institute of Technology
基金 黑龙江省普通高等学校骨干教师创新能力计划资助项目(1053G033).
关键词 封装 模态分析 震动隔离 声-振动传感器系统 Encapsulation Finite element method Microelectromechanical devices Modal analysis Natural frequencies Sensors Vibrations (mechanical)
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参考文献8

  • 1李秀清,周继红.MEMS封装技术现状与发展趋势[J].半导体情报,2001,38(5):1-4. 被引量:10
  • 2BALTES H, BRAND O, WAELTI M. Packaging of CMOS MEMS [ J ]. Microelectronics Reliability, 2000,40:1255 - 1262.
  • 3BRAND O, BALTES H. Microsensor packaging [ J ].Microsystem Technologies ,2002 (7): 205 208.
  • 4任天令,张林涛,刘理天,李志坚.新型集成微麦克风和扬声器的结构设计[J].半导体技术,2000,25(5):7-9. 被引量:1
  • 5SCHEEPER P R. A Review of Silicon Microphones [ J ].Sensors and Actuators A, 1994,44( 1 ) :1 -11.
  • 6SESSLER G M. Acoustic Sensors [ J ]. Sensors and Actuators A, 1991,26( 1 -3) :323 -330.
  • 7杨庆柏.振动传感器及应用[J].传感器世界,1998,4(11):34-35. 被引量:4
  • 8户原春彦 牟传文译.防振橡胶及其应用[M].北京:中国铁道出版社,1982..

二级参考文献9

  • 1[1]Michael C B et al. Microassembly Technologies for MEMS. Part of the SPIE Conference on Structures and MEMS for Optical Processing, 1998; 3513:2
  • 2[2]Chad B et al. Challenges in the Packaging of MEMS. International Symposium on Advanced Packaging Material, 1999; 41
  • 3[3]Von Arx J. Hermeticity Testing of Glass-Silicon Packages with On-Chip Feedthroughs. The 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors, 1995; 244
  • 4[4]Mutschall D et al. Basic Micro Module for Chemical Sensors with on Chip Heater and Buried Sensor Structure. 8th International Conference on Solid-State Sensors and Actuators, and Eurosensors, 1995; 256
  • 5[5]Mayer F et al. Flip-Chip Packaging for Smart MEMS. Part of the 1998 SPIE on Smart Electronics and MEMS, 1998; 183
  • 6[6]Bossche A et al. MEMS Packaging: State of the Art and Future Trends. Part of the 1998 SPIE on Smart Electronics and MEMS,1998; 166
  • 7[7]Rao Tummala R. SLIM: Third Generation of Packaging Beyond MCM,CSP, Flipchip Micro-via Board Technologies. 1998 IEEE/CPMT Electronics Packaging Technology Conference, 1998; 1
  • 8Chang S H,IEEE Trans Ultrason Ferroclectr Freq Cotr,1999年,46卷,2期,441页
  • 9Ried R P,Proc Micromech Syst ASME Winter Annual Meet,1992年,23页

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