期刊文献+

化学气相沉积制备碳化钨纳米晶薄膜 被引量:6

Plasma enhanced chemical vapour deposition Nanocrystalline tungsten carbide thin films
在线阅读 下载PDF
导出
摘要 采用氟化钨(WF6)和甲烷(CH4)为前驱体,采用等离子体增强化学气相沉积(PECVD)方法制备具有纳米晶结构的碳化钨薄膜.采用SEM,XRD,EDS等方法表征了碳化钨薄膜的形貌、晶体结构和化学组成.通过表征,表明在前驱体混合气体中的甲烷与氟化钨气体的流量比(碳钨比)为20,基底温度为800 ℃的条件下得到的碳化钨薄膜是由直径为20~35 nm的圆球状纳米晶构成.通过分析影响薄膜的晶体结构、化学组成的因素后,认为要得到具有纳米晶结构的碳化钨薄膜,主要应控制前驱体气体中的碳钨比以及基底温度. Nanocrystalline tungsten carbide thin films have been deposited by low temperature plasma enhanced chemical vapour deposition from a WF6/CH4/H2/Ar mixture on Aluminum substrates. The phase composition of the deposition films were characterized by X-ray diffraction (XRD), Scanning electron microscopy (SEM) and energy-dispersive spectrometer (EDS). The results show that with the precursor CH4/WF6 concentration ratio 20 the tungsten carbide thin film, composed of 20-35 nm diameter sphere nanocrystallines, deposited at temperature 800 ℃. It was also found that the formation of nanocrystalline resulted from the effect of the precursor CH4/ WF6 concentration ratio and deposition temperature.
出处 《浙江工业大学学报》 CAS 2005年第4期368-371,共4页 Journal of Zhejiang University of Technology
基金 国家自然科学基金项目(20276069) 浙江省自然科学基金重大资助项目(ZD0024)
关键词 碳化钨 纳米晶薄膜 等离子增强化学气相沉积 tungsten carbide Nanocrystalline thin film PECVD
  • 相关文献

参考文献7

  • 1Sun Y M, Lee S Y, Lemonds A M , et al. Low temperature chemical vapor deposition of tungsten carbide for copper diffusion barriers[J].Thin Solid Films,2001,39:109-115.
  • 2Burstein G T, Barnett C J,Kucernak R J, et al. Anodic oxidation of methanol using a new base electro-catalyst [J]. Electrochem Soc, 1996, 143(7): 129.
  • 3Keller V, Wehrer P,Garin F, et al. Catalytic activity of bluk Tungsten carbides for alkane reforming[J]. Catal, 1997, 166:125.
  • 4Barnett C J, Burstein G T B, Kucernak R J, et al. Electro-catalytic activity of some carburised nickel,tungsten and molybdenum compounds[J].Electrochemica Acta,1997,42(15):2381.
  • 5Kear B H, McCandlish L E. Chemical processing and properties of nano-structured tungsten carbide cobalt materials[J]. Nanostruct Mater, 1993, 3:19-25; 1995, 5:555-558.
  • 6Choy K L . Chemical vapour deposition of Coatings[J]. Progress in Materials Science, 2003, 48: 57-170.
  • 7Hogberg H , Tagtstrom P, Lu J, et al. Chemical vapour deposition of tungsten carbides on tantalum and nickel substrates[J]. Thin Solid Films, 1996, 272:116-123.

同被引文献91

引证文献6

二级引证文献16

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部