摘要
采用普通型瓦特液,按照不同的工艺参数在铜材表面电镀镍,通过SEM对镀层表面进行扫描观察和使用XRD测试对镀层表面进行检测,并且对不同样品数据进行对比和分析,从而达到研究电流密度及润湿剂对镀层沉积速度、表面显微形貌和晶粒尺寸的影响的目的。实验结果表明,电流密度的影响非常显著,不同电流密度下的镀层表面形貌和晶粒尺寸存在相应的差别。适量的润湿剂对镀层的沉积具有促进作用,对防止针孔的生成及细化晶粒具有明显的效果。
According to different technical parameters, nickel coating is electrodeposited on the surface of copper sheet in Watt＇s solution. By means of SEM and XRD analysis of the surface of nickel coating, the data of different samples were contrasted and analysed. The effects of current density and wetting agent on the deposition rates, surface morphologies and crystal grain sizes of nickel coating are investigated. The results show that the effects of current density on the characterization of nickel coating are very remarkable. The surface morphologies and crystal grain sizes are different evidently with different current densities. Proper nickel deposition rate, make the grains finer, and prevent the formation of wetting agent content can accelerate the pinholes obviously.
出处
《表面技术》
EI
CAS
CSCD
2005年第5期43-45,共3页
Surface Technology
关键词
镍镀层
晶粒度
电流密度
润湿剂
针孔
Nickel electroplating
Granularity
Current density
Wetting agent
Pinhole
