摘要
成功地用真空扩散焊法获得了Ｔｉ６Ａ１４Ｖ／Ａｌ２Ｏ３的连接界面。分析了不同温度下的界面结构、界面反应情况，同时用压痕法初步偿派了界面残余应力分析。结果表明，在８００℃时扩散焊界面上没有显著的化学反应，随着温度的提高，界面上Ｔｉ６Ａ１４Ｖ和Ａｌ２Ｏ３反应生成ＴＩＡｌ、Ｔｉ２Ａｌ、Ｔｉ３Ａｌ与Ｔｉ组成的脆性混合过渡层。该过渡层，并通过氧的固溶使基体金属脆化；压痕裂纹扩展方式可以在一定程度上反映残余应力的局部分布特征。
Close-contacted interface of Ti6A14V/Al2O3 was successfully obtained by direct diffusion bonding under a vacuum condition. Interface structure and reactions were investigated by means ofSEM and XRD. Residual stress of the structure was characterized by analysing propagating behavior ofindentation crack. Results showed that no profound evidence of chemical reaction can be observed at theinterface of 800'C bonded sample, however, with increasing temperature interface reactions were activated, as a result a brittle transition layer appeared between metal and ceramic members, which may bea complex fixture of TiAJ.TiAl,.TiAl2,and Ti. By the way, oxygen atoms generated from interfacialreactions diffused into the metal base, soluted in and embrittled it. It's also found that local residualstress state could be reflected by indentation crack analyses, at least qualitatively.
出处
《机械工程材料》
CAS
CSCD
1996年第1期14-17,52,共5页
Materials For Mechanical Engineering
