摘要
用扫描电镜观察、能谱分析、电子探针和显微硬度测定等方法对铜/钢双金属棒扩散复合界面附近的组织、成分和硬度进行了分析。结果表明,铜/钢双金属通过扩散复合可使界面实现良好的冶金结合。随扩散温度的提高,两种金属的结合强度大大提高;随扩散时间的延长,结合强度先增加后趋于稳定,与一定的扩散温度相对应。扩散退火过程中,界面两侧的原子发生了互扩散。从扫描电镜和电子探针结果中可以确定铜/钢界面附近的氧化物为 Fe_2O_3。
The microstructure, concentration and micro-hardness near the interface of copper /steel bimetallic bar through diffusing process were analyzed by means of scanning electron microscope, energy disperse analysis of X-ray and electron probe microscope analysis. The results indicate that copper and steel can be well bonded metallurgically after diffusion annealing. The interface bonding strength increases dramatically with increasing diffusion temperature in the diffusing process. Bonding strength is enhanced rapidly in the beginning and finally will wave around certain value with the extending of diffusion time. The interdiffusion phenomenon near the interface of copper-steel was observed. The oxide is determined to be Fe2O3 according to the results of SEM and EPMA.
出处
《有色金属加工》
CAS
2006年第2期34-37,共4页
Nonferrous Metals Processing
基金
辽宁省教育厅计划资助项目(202033216)
关键词
铜/钢界面
扩散复合
界面
结合强度
interface of copper/steel
diffusion bonding
interface
bonding strength
