摘要
激光试验装置中的整体式铜腔靶精度要求高，现有机加工方法不能满足要求。为此，在预处理芯轴（聚甲基丙烯酸甲酯）表面采用化学镀法制备铜空腔，研究了镀液中甲醛含量、pH值、温度等对镀速和镀液稳定性的影响。确定了适宜的化学镀铜工艺为：10g/L硫酸铜，10～20mL／L甲醛，40g／L酒石酸钾钠，20g／L乙二胺四乙酸二钠，0．1g／L稳定剂（2，2-联吡啶），pH值12．0～13．0，温度40～70℃。制备的铜空腔壁厚达25μm，表面无砂眼、裂纹等缺陷，刻蚀芯轴后空腔能自持。
Electroless plating was performed to fabricate integral copper hohlraum on the surface of pretreated core axis made of polymethyl methacrylate (PMMA) used for a laser device. The effects of the content of formaldehyde as the reducing agent and pH value and temperature of the plating bath on the deposition rate and bath stability were studied. The optimization of the bath formulation and plating parameters was established. As the results, the optimized bath was suggested to be composed of 10 g/L CuSO_ 4, 20 g/L Na_ 2EDTA, 40 g/L potassium and sodium tartarate, 0.1 g/L stabilizing agent, 10~20 mL/L formaldehyde; while the optimal pH value and temperature of the plating bath were suggested to be 12.0~13.0 and 40~70 ℃, respectively. The copper coating prepared under the optimized conditions had a wall thickness as much as 25 μm and was free of cavities and cracks. After removal of the core axis by chemical etching, the remaining copper hohlraum was able to keep its shape in the absence of external load.
出处
《材料保护》
CAS
CSCD
北大核心
2006年第4期69-70,共2页
Materials Protection
基金
国家863高技术804-4专题资助
关键词
化学镀铜
铜空腔
镀速
electroless Cu plating
copper hohlraum
deposition rate
