摘要
在回顾现有的引线键合技术之后,文章主要探讨了集成电路封装中引线键合技术的发展趋势。球形焊接工艺比楔形焊接工艺具有更多的优势,因而获得了广泛使用。传统的前向拱丝越来越难以满足目前封装的高密度要求,反向拱丝能满足非常低的弧高的要求。前向拱丝和反向拱丝工艺相结合,能适应复杂的多排引线键合和多芯片封装结构的要求。不断发展的引线键合技术使得引线键合工艺能继续满足封装日益发展的要求,为封装继续提供低成本解决方案。
After reviewing current wire bonding technology, wire bonding technology development trends are discussed. Ball bonding has more advantages than wedge bonding, so that it is widely used in IC Packaging. Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height. Integrated forward looping and reverse looping, complex multi layer wire bonding and multi chip packaging can be achieved. Summarily, with continuously developing wire bonding technology, it can meet advanced packaging requirement and provide a low cost solution for packaging.
出处
《电子与封装》
2006年第7期16-20,共5页
Electronics & Packaging
