摘要
利用E-44环氧树脂对二氨基二苯基甲烷环氧树脂固化剂(DDM)进行了改性,合成了含有羟基的E-44-DDM固化剂(M-DDM)。以所合成的M-DDM粉体为囊芯、以2,4-甲苯二异氰酸酯(TD I)为壁材单体,采用界面聚合技术,首次成功制备了一种新型聚脲M-DDM微胶囊固化剂。该微胶囊固化剂粒径分布较窄,平均粒径约为2.54μm。囊壁是TD I与囊芯粉体表面的羟基通过加成聚合反应形成的,壁厚约为100 nm。所制备的微胶囊固化剂具有优良的固化性能和潜伏性能,可以在100℃使环氧树脂E-51在1 h内固化,并且其室温潜伏期可达6个月以上。
E-44 epoxy resin was used to modify 4,4＇diaminodiphenylmethane （DDM）in this study, and a new type of curing agent E-44-DDM （M-DDM） was successfully prepared. The achieved M-DDM was encapsulated to be a novel microcapsule-type latent curing agent by an interracial polymerization process from the synthesized M-DDM as core material and tolylene diiso cyanate （TDI） as wall monomer. The prepared microcapsules displayed a narrow size distribution with the mean size of about 2.54μm. The wall membrane, with the wall thickness of about 100nm, was formed by a polyaddition between M-DDM and TDI at the interface. The achieved M-DDM microcapsule-type curing agent showed an advanced curing ability and a latent property in E-51 epoxy resin system. It is found that the E-51/M-DDM microcapsule system can be cured at 100 ＇C in lh and the latent period at room temperature is more than 6 months.
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2006年第4期196-199,共4页
Polymer Materials Science & Engineering
基金
国防预研基金(51489040104KG0101)
关键词
微胶囊
潜伏性固化剂
环氧树脂
界面聚合法
microcapsule
latent curing agent
epoxy resin
interracial polymerization process
