摘要
基于弹性力学和板壳力学理论,分析了微型高温压力传感器圆形膜片的受力分布,为力敏电阻在应变膜上的布置提供依据;利用有限元分析方法,借助ANSYS仿真软件,对微型高温压力传感器应变膜进行了一系列的分析和计算机模拟,探讨了传感器圆形应变膜简化应力模型的合理性以及温度对应力差分布的影响,得到了直观可靠的结果,为微型高温压力传感器芯片设计和研发新颖的微型高温压力传感器芯片提供有力的依据.
Stress distribution of the micro-type high temperature pressure sensor circular thin diaphragm is deduced by elastic mechanics theory and theory of plates and shells and it will provide reference for the disposition of sensing resister in strain membrane. A series of micro-type high temperature pressure sensor chips are analysed and simulated by using ANSYS software on the account of Finite-Element Analysis （FEA） theory. The distribution of the difference between stresses of sensor strain membrane is demonstrated carefully and reliable result is achieved. The result benefits the design of sensing resistor disposition of in strain membrane and fabrication of novel micro-type high temperature pressure sensor.
出处
《传感技术学报》
CAS
CSCD
北大核心
2006年第05B期1829-1831,共3页
Chinese Journal of Sensors and Actuators
基金
浙江省科技攻关计划项目资助(2005C31048)
江苏大学博士生创新基金项目资助
关键词
高温压力传感器
力敏电阻
芯片
优化
high temperature pressure sensor
sensing resistor
chip
optimization
