摘要
采用LTCC技术制造的多层基板是高密度微波多芯片组件的关键部件,其多层微波传输线的性能将直接影响组件的性能。对LTCC多层基板中微带线、带状线及其互连过渡结构的性能进行了仿真,通过优化接地通孔的设置,有效地抑制了谐振,扩展了应用的频率范围。
LTCC multilayer substrate is the key element of high - density MMCM （ microwave multi-chip module）. The performance of the module is significantly influenced by multilayer microwave transmissi The microstfipline, stfipline and the transition between them are simulated and optimized by changing ring of grounding vias. The resonance is decreased effectively and the frequency band is widened. on line. the setting of grounding vias. The resonance is decreased effectively and the frequency band is widened.
出处
《电子机械工程》
2006年第6期45-48,共4页
Electro-Mechanical Engineering
