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衬底材料和溅射方法对CN_x薄膜膜基结合力的影响 被引量:2

Effect of Underlay Materials and Sputtering Method on Adhesive Force of CN_x Films
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摘要 分别将 W18Cr4V 高速钢和 YG8硬质合金作为衬底材料,用直流磁控溅射和射频磁控溅射法制备了 CN_x薄膜,用划痕法测定了薄膜和衬底材料之间的膜基结合力。结果表明:YG8硬质合金作为衬底材料时薄膜的膜基结合力较高;对 YG8硬质合金衬底材料进行适当的腐蚀处理或溅射一层 TiN 中间层,薄膜的膜基结合力明显提高;对于两种衬底材料,射频磁控溅射法制备的薄膜膜基结合力明显高于直流磁控溅射法制备的薄膜。 CNx films were prepared by DC and RF magnetron sputtering with W18Cr4V high-speed steel and YG8 hard alloy underlay. The adhesive force of CNx films was studied by scratch test. The research indicate that the adhesive force of CNx films is high when YG8 hard alloy was applied as underlay. The adhesive force of CNx films can be enhanced when YG8 underlay is corroded or TiN middle transition layer is added. RF magnetron sputtering is in favor of the adhesive force of CNx films for both W18Cr4V and YG8 underlay.
出处 《机械工程材料》 CAS CSCD 北大核心 2006年第12期7-10,共4页 Materials For Mechanical Engineering
关键词 磁控溅射 衬底 CNX薄膜 结合力 magnetron sputtering underlay CNx film adhesive force
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共引文献29

同被引文献21

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