摘要
SiCp/1060Al, SiCp/ZL101,SiCp/ZL102 composites with SiCp volume fraction of 55% were fabricated by pressureless infiltration. The microstructure was examined and thermal properties were characterized for SiCp/Al composites. The results show that the composites are dense and macroscopically homogeneous. With the increase of temperature, the mean linear coefficient of thermal expansion(CTE) at 25-200℃of the composites increases and ranges from 7.23×10-6 to 10.4×10-6K-1, but thermal conductivity declines gradually at the same time. With the increase of Si content in the Al matrix, CTE of the composites declines and thermal conductivity also declines but not linearly, when Si content is up to 7%, the average thermal conductivity is 140.4 W/(m·K), which is close to that of the SiCp/1060Al composite (144.6 W/(m·K)). While Si content is 11.7%, the average thermal conductivity declines markedly to 87.74 W/(m·K). The annealing treatment is better than the solution aging treatment in reducing CTE and improving thermal conductivity of the composites. Compared with conventional thermal management materials, SiCp/Al composites are potential candidate materials for advanced electronic packaging due to their tailorable thermo-physical properties.
SiCp/1060Al, SiCp/ZL101, SiCp/ZL102 composites with SiCp volume fraction of 55% were fabricated by pressureless infiltration. The microstructure was examined and thermal properties were characterized for SiCp/Al composites. The results show that the composites are dense and macroscopically homogeneous. With the increase of temperature, the mean linear coefficient of thermal expansion（CTE） at 25-200℃ of the composites increases and ranges from 7.23×10^-6 to 10.4×10^-6 Kl, but thermal conductivity declines gradually at the same time. With the increase of Si content in the Al matrix, CTE of the composites declines and thermal conductivity also declines but not linearly, when Si content is up to 7%, the average thermal conductivity is 140.4 W/（m-K）, which is close to that of the SiCo/1060Al composite （144.6 W/（m·K））. While Si content is 11.7%, the average thermal conductivity declines markedly to 87.74 W/（m-K）. The annealing treatment is better than the solution aging treatment in reducing CTE and improving thermal conductivity of the composites. Compared with conventional thermal management materials, SiCp/Al composites are potential candidate materials for advanced electronic packaging due to their tailorable thermo-physical properties.
出处
《中国有色金属学会会刊：英文版》
CSCD
2006年第A03期1552-1556,共5页
Transactions of Nonferrous Metals Society of China
基金
Project(0450100) supported by the Natural Science Foundation of Jiangxi Province
Project(2006[167]) supported by the Ministry of Education in Jiangxi Province, China
关键词
金属加工
金属熔渗
热量传递
铝合金
硅
SiCp/Al composite
pressureless infiltration
thermal expansion coefficient
thermal conductivity
