摘要
以TMA和TGA研究了含酚羟基的有机烷氧基硅烷及3,3′,3″-三羟基苯氧基硅烷三缩水甘油醚等多种自行设计、合成的有机硅改性剂改性双酚F环氧树脂的热性能。研究结果表明,有机硅可降低改性树脂的线胀系数,但端环氧基脂肪族聚硅氧烷及含酚羟基的二官能度有机硅的加入均使固化物玻璃化温度降低10℃以上;含环氧基的多官能度有机硅改性剂3,3′,3″-三羟基苯氧基硅烷三缩水甘油醚的加入可使线胀系数降低约20%,内应力指数降低约20%,抗开裂指数提高50%以上,固化物玻璃化温度基本不变,热分解温度有较大幅度的提高,是一种理想的环氧树脂增韧改性剂,可用于电子封装等行业用环氧树脂的改性。
Thermal properties of biphenol F epoxy modified by several organic silane were studied by TMA and TGA. The test showed that the thermal expansion coefficient of modified cured system could be reduced by organic silane modifier meanwhile Tg of epoxy modified by epoxy group terminated two functional aliphatic polysiloxane （TTAP） and 3, 3＇-dihydroxyldiphenoxy silane （DHDPS） decreased 10 ℃ but epoxy resin modified by 3, 3＂, 3＂- trihydroxyhriphenoxy silane triglycidyl ether （THTPS） remained high Tg temperature, the thermal expansion coefficient reduced about 20%, the internal stress index decreased about 20% , the crack resistance index increased by 50% and thermal resistance was greatly improved. The present result indicated that it was an ideal modifier for epoxy resin to improve toughness and reduce thermal expansion coefficient for electricity application.
出处
《热固性树脂》
CAS
CSCD
2007年第2期7-10,15,共5页
Thermosetting Resin
基金
国家863高技术资助项目(2002AA333140)
关键词
环氧树脂
有机硅
改性
热性能
韧性
epoxy resin
organic silane
modification
thermal properties
toughness
