摘要
介绍了电子设备结构中针对散热、冲击振动和电磁兼容等方面的优化设计内容和现状,及其三者兼顾的综合优化设计方法结构优化设计支撑软件技术要求和具体内容,并以一具体项目作为案例进行说明。
This paper mainly describes the optimization content and current status of electronics equipment structural design on heat dissipation, anti - vibration and anti - shock, electromagnetic compatibility （ EMC）, etc. Then it presents an integrated optimization method considering three factors--technical specifications and detailed content of supporting software applied to structural optimization design. Finally, it analyzes a case based on a project to explain supporting software technique.
出处
《电讯技术》
2007年第2期189-193,共5页
Telecommunication Engineering
关键词
电子设备
结构优化设计
散热设计
抗冲振设计
电磁兼容设计
支撑软件
CAD/CAE
electronics equipment
structural optimization design
heat dissipation design
anti - shock and anti - vibration design
EMC design
supporting software
CAD/CAE
