摘要
本文利用环形电镀金刚石线锯对硬脆材料单晶硅、LT55陶瓷进行了切割试验,研究了锯切力、材料加工表面质量及锯丝的磨损。研究发现,在相同加工参数下,切割LT55陶瓷时的法向力与切向力之比小于单晶硅,与磨削相比,线锯加工的法向力与切向力之比非常小;在本实验条件下,单晶硅和LT55陶瓷均为脆性去除方式;因为LT55陶瓷断裂韧性高,在同样加工条件下,陶瓷加工表面质量优于单晶硅;恒进给压力条件下,锯丝速度增加,粗糙度值略微减小,恒进给压力增加,粗糙度值明显增大;锯丝首先在焊口处断裂,由于锯丝不能自转,沿锯丝圆周方向磨损不均匀。
The cutting experiment of silicon and LT55 ceramic using endless electroplated diamond wire saw was conducted. The cutting force, cutting surfaces quality and wear of wire saw were studied. The normal-to-tangential force ratio when cutting LT55 ceramic is less than that when cutting silicon. The normal-to-tangential force ratio in wire saw cutting is less than in grinding. On the condition of experiment, silicon and LT55 ceramic were removed in a brittle regime. Because the fracture toughness of ceramic is higher than silicon, the cutting surface is better than silicon. For constant force feed, the surface roughness Ra decreases slightly with the increase of wire speed. And the surface roughness Ra increases with the increase of constant feed force. The breakage of wire saw took place at the weld point. For the wire saw can not self rotate, the wear of it was not even.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2007年第3期56-59,共4页
Diamond & Abrasives Engineering
基金
山东省自然科学基金资助项目(Y2006F16)
关键词
硬脆材料
环形电镀金刚石线锯
加工试验
hard-brittle materials endless electroplated diamond wire saw cutting experiment
