摘要
热导极为微小的热敏悬空微桥结构的制作是集成非致冷热成像探测阵列热敏感单元研究的核心。由于没有现成的将聚酰亚胺制成微桥的工艺,采用准分子激光微刻蚀技术,使用聚酰亚胺材料,并采用铂作为敏感材料来制作微桥。对所制作的铂/聚酰亚胺微桥原理性样件的初步测试表明,铂/聚酰亚胺微桥的热导约3.98×10-7W/K,与理论计算值接近。铂薄膜与聚酰亚胺微桥附着良好,工艺可行。在0～10V的驱动电压下可观察到铂/聚酰亚胺微桥样件明显的自热效应,其电加热响应时间小于100ms。
One of the key techniques of integrating uncooled heat imaging detector arrays is the manufacturing of the heat-sensitive suspended microbridge with ultra-low thermal conductivity.A polyimide suspended microbridge was manufactured with laser micromachining by Pt heat-sensitive thin film prepared by pulsed laser deposition technology.The test performances of the Pt/polyimide microbridge made by laser micromachining show that the thermal conductivity of the Pt/polyimide microbridge is 3.98×10^-7 W/K.The Pt thin film adheres well to the polyimide substrate.The thermal conductivities of the bridge legs are so low that the Ⅰ-Ⅴ characteristic line of Pt/polyimide microbridge curves obviously when the bia voltage is 0～10 V.The response time of Pt/polyimide microbridge is shorter than 100 ms.
出处
《微纳电子技术》
CAS
2007年第10期952-956,共5页
Micronanoelectronic Technology
关键词
非致冷红外探测
热敏悬浮微桥
激光微刻蚀
微机电系统
uncooled infrared detecting
heat-sensitive suspended microbridge
laser micromachining
micro electro mechanical systems（MEMS）
