摘要
制备了DCPD苯酚树脂,利用该树脂与环氧氯丙烷反应,制备出了DCPD环氧树脂,采用红外光谱分析对所生成的DCPD环氧树脂结构进行了表征,测定了DCPD环氧树脂的羟基值、环氧值、相对分子质量和氯含量。同时采用自制的DCPD环氧树脂作为基体树脂,制备了集成电路(IC)封装用DCPD环氧树脂模塑料。结果表明,制得的DCPD环氧模塑料的吸水率低(0.22%),玻璃化温度高(175℃),热变形温度高(282℃),可用于大规模集成电路IC的无铅封装。
The DCPD-phenol epoxy resin was manufactured by the reaction of DCPD-phenol resin with epichlorohydrin. The structure of DCPD-phenol epoxy resin was determined by FTIR and the properties of DCPD epoxy resin such as hydroxyl equivalent, epoxy equivalent, molecular weight and chloride concentration were measured. With the DCPD epoxy resin as the matrix resin, the molding compound used for the packaging of IC was prepared. The results show that the molding compound based on DCPD-phenol epoxy resin has high glass transition temperature（175 ℃） , high heat distortion temperature（282 ℃） and very low water absorption（0.22%） and can be used for the lead-free packaging of large-scale IC.
出处
《现代塑料加工应用》
CAS
北大核心
2007年第5期12-15,共4页
Modern Plastics Processing and Applications
基金
北京市自然科学基金(2072007)
关键词
双环戊二烯
苯酚
环氧树脂
合成
电子封装
模塑料
dicyclopentadiene
phenol
epoxy resin
synthesis
electronic packaging
molding compound
