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SiC_p/Cu复合材料的显微组织和力学性能 被引量:11

Microstructure and Mechanical Properties of SiC_p/ Cu Composites
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摘要 采用非均相沉淀包裹法制得铜包SiC复合粉体,利用热压烧结工艺制备了含有体积分数为20%~65%SiC颗粒的SiCP/Cu复合材料。用X射线衍射仪、扫描电镜、能谱分析等测试方法对试样进行了成分和微观形貌分析。结果表明:包裹法制得的Siq/Cu复合材料中基体铜形成连续的结构,SiC分散较均匀;随着SiC含量的增加,试样孔隙率提高,抗弯强度下降;而硬度则先增后降,并在SiC体积分数为35%时出现最大值;所有试样均表现为脆性断裂。 Cu coated SiC composite powders were made by the heterogeneous precipitation coating method and the hot pressing process was used to prepare SiCp/Cu composites with 20%-65%SiC particles. The composition and microstructure of samples were characterized by X-ray diffraction, SEM with EDS. Continuous matrix copper is obtained in the composites with the SiC particles distributed uniformly. The porosity of the composites increase, but the flexural strength decrease with increasing fraction of SiCk. The composites with 35%SiCp show the highest hardness. All samples exhibit brittle fracture behavior.
出处 《机械工程材料》 CAS CSCD 北大核心 2007年第9期48-50,54,共4页 Materials For Mechanical Engineering
基金 河南省杰出青年科学基金资助项目(512002200)
关键词 Siq/Cu复合材料 包裹 热压烧结 SiCp/Cu composite 0 coating hot pressing process
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参考文献10

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