摘要
在组成为：０．２２ｍｏｌ／Ｌ硫酸镍、０．０６ｍｏｌ／Ｌ钼酸钠和０．３ｍｏｌ／Ｌ柠檬酸钠的溶液，于纯铜片上采用恒电流沉积，所得Ｎｉ－Ｍｏ合金沉积层经Ｘ射线衍射测定，结果表明在温度为２５℃～５０℃，电流密度为１０ｍＡ·ｃｍ－２～３０ｍＡ·ｃｍ－２范围，Ｎｉ－Ｍｏ合金沉积层表现为（１１１）择优取向．循环伏安和电位阶跃实验表明镍钼合金电结晶过程按照连续成核和三维生长方式进行．Ｎｉ－Ｍｏ合金电沉积过程的电化学交流阻抗谱表明Ｎｉ－Ｍｏ共沉积过程经历了吸附中间产物步骤，由于吸附态物种氢氧化镍和钼的氧化物将阻化晶粒（１１１）晶面的生长，从而使镍钼沉积层表现为（１１１）择优取向．
Ni Mo alloy deposits with (111) preferred orientation was obtained in a solution of 0.22 mol/L NiSO 4·6H 2O, 0.06 mol/L Na 2MoO 4·2H 2O and 0.3 mol/L Na 3C 6H 5O 7·2H 2O in temperature from 25℃ to 50℃,and current densities ranged from 10 mA·cm -2 to 30 mA·cm -2 . The electrodeposition of Ni Mo alloy was studied by cylic voltammetry and potential step experiment. It was shown that Ni Mo alloy is formed by mechanism involving progressive nucleation followed by three dimensional growth of the metal centres. The complex plane impedance plots indicate codeposition of Ni Mo alloy involves the intermediate adion. The growth of (111) plane of crystallite is inhibited with adsorption of (NiOH) ads and MoO 2, So Ni Mo alloy deposit exhibits (111) preferred orientation.
出处
《电化学》
CAS
CSCD
1997年第2期174-178,共5页
Journal of Electrochemistry
基金
国家自然科学基金
关键词
镍钼合金
电沉积
织构
电结晶机理
Ni Mo alloy electrodeposition, Texture, Electrocrystallization mechanism
