摘要
电真空应用中，要求高纯氧化铝与无氧铜的连接接头具有较高的强度和气密性。采用Ag-Cu-Ti活性钎料直接钎焊高纯氧化铝陶瓷与无氧铜，研究了钎焊温度和保温时间对接头组成、界面反应以及接头抗剪强度的影响，研究了铜基体材料对钎焊接头组织和界面反应的影响。钎焊温度850～900℃，保温时间20～60min时，接头抗剪强度接近或达到90MPa。钎焊工艺参数偏离上述范围时，接头抗剪强度较低。接头由Cu／Ag（Cu），Cu（Ag，Ti）／Cu3Ti3O（TiO2）／Al2O3组成，反应层以Cu3Ti3O为主，个别工艺条件下有一定量的TiO2生成，铜基体视工艺条件的不同对钎焊接头组织有一定影响。
The joints of high purity alumina ceramic and oxygen-free copper with high strength and low gas loakage are needed in electron tube. This work investigates the effects of brazing tempurature,holding time and copper matrix on the joint microstructures,shear strength and interface reactions. The joints with shear strength close to 90 MPa could be achieved by brazing with AgCuTi at the temperature of 850-900 ℃ and the holding time of 20-60 min. Lower or higher temperature and shorter or longer holding time are detrimental to joint strength. The joint is consisted of Cu/Ag(Cu),Cu(Ag,Ti)/Cu 3Ti 3O(TiO 2)/Al 2O 3. The main product in the reaction layer was Cu 3Ti 3O, and TiO 2 was observed at certain parameters. The effects of copper matrix on the joint microstructures were different based on the parameters.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2008年第3期53-56,共4页
Transactions of The China Welding Institution
关键词
高纯氧化铝陶瓷
无氧铜
钎焊
接头抗剪强度
接头组织
high purity alumina ceramic
oxygen-free copper
brazing
shear strength
microstructures
