摘要
目前,大量的工业级芯片及电子模块产品已经开始运用到军用电子产品领域。通过对某机载计算机中的带PMC背板的VME模块的热加固方法进行分析,阐述了工业级芯片及电子模块产品军用化的热加固基本思想和方法,揭示了在对工业级产品进行加固时应注意的问题,从而为有效解决该类模块的热加固问题打下基础。
Currently,a large number of industrial products and commercial products have been used in military equipment system. How this type of products to be ruggedized ？ By analysing the ruggedization method of the VME module equipped with PMC card in some airborne computer,we expatiated on the basic idea and the method of the heat ruggedization problem for industrial components and modules used in military equipment system. At the same time we posted some problems should be pay attention during deal with heat ruggedization case. Doing in this way we may deal with the heat ruggedization case drastically.
出处
《航空计算技术》
2008年第3期104-106,共3页
Aeronautical Computing Technique
关键词
电子产品
热加固
VME
electronics products
heat ruggedization
VME
