摘要
为了解决半导体激光器封装的热应力和变形问题,利用有限元软件ANSYS对SnPb、In、AuSn三种焊料焊接激光器管芯的情况分别进行了模拟,得到了相应的热应力大小和变形情况,分析了焊料和热沉对激光器热应力和变形的影响。对比了这几种不同封装方法的激光器发光区图像的弯曲程度,验证了模拟结果。由模拟和实验结果可见,采用In焊料是减小激光器热应力和变形的最佳选择。另外,适当增加热沉厚度,选择热匹配的材料,焊接时进行预热,可减小激光器的热应力和变形。通过模拟和实验分析,提出了减小热应力和变形的方法,为优化激光器的封装设计提供了参考依据。
A key technology problem of semiconductor lasers packaging is to minimize thermal stress and deformation. We took use of software in simulating thermal stress and deformation of the lasers sintered by SnPb, In and AuSn solder respectively. The effect of different solder and heat sinks were calculated and analyzed using steady simulation method. The deformation of lasers by measuring emitting zone images of lasers were consistent with that of the simulation results. According to the simulation and experiment results, we can conclude that indium solder is the best choice to decrease thermal stress and deformation. Increasing the thickness of carriers, selecting thermal suited material and warm-up in welding are all good techniques. Good techniques to minimize thermal stress and deformation were obtained by the simulation and experiment analysis. The obtained conclusions may help to optimize packaging design of lasers.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第8期718-720,共3页
Semiconductor Technology
关键词
半导体激光器
热应力
变形
焊料
封装
semiconductor laser
thermal stress
deformation
solder
packaging
