摘要
借助弹性力学和板壳力学理论,建立了双岛型耐高温压力传感器应变膜的简化力学模型,得到近似应力分布的数学模型。利用有限元分析方法,借助ANSYS仿真软件,对应变膜进行一系列的计算机模拟,探讨了简化应力模型的合理性以及温度对应力差分布的影响,为力敏电阻在应变膜上的布置、研发新颖的高温压力传感器芯片提供有力的依据。
It set up a simplified mechanic model for strain diaphragm Twin-isle of high temperature pressure sensor by elastic mechanics theory and theory of plates and shells, deduce approximate stress distribution formulas ;strain membrane are analyzed and simulated by using ANSYS software on the account of Finite-Element Analysis （FEA） theory, discuss rationality of The simplified stress model and effect of temperature on distribution of the difference between stresses of sensor strain membrane, it will provide reference for the disposition of sensing resister in strain membrane and development of novel high temperature pressure sensor chip.
出处
《机械设计与制造》
北大核心
2008年第10期19-21,共3页
Machinery Design & Manufacture
关键词
耐高温压力传感器
力敏电阻
芯片
优化
High temperature pressure sensor
Sensing resistor
Chip
Optimization
