摘要
采用扫描电子显微镜及万能材料实验机,研究分析了Sn-9Zn/Cu钎焊接头在150℃下长期时效过程中界面形貌及接头剪切性能的变化。结果表明:时效前,Sn-9Zn/Cu界面为薄且平直的Cu-Zn金属间化合物层(IMC)。经过时效处理后,IMC层厚度明显增加,变得粗大不平,而且有Cu-Sn化合物生成。同时,Sn-9Zn/Cu钎焊接头的剪切强度明显下降,时效至1 000 h时剪切强度仅为初始的40.65%。时效过程中剪切断口的脆性断裂趋势逐渐增大。
The microstructure and shear property of Sn -9Zn/Cu brazed joint under 150 ℃ thermal exposure conditions were investigated by means of scanning electron microscope and universal material machine. The results show that interface layer（IMC） of Sn -9Zn/Cu is leveling serrate consisting of Cu - Zn compounds. After long - time aging treatment, the growth of compounds made IMC layer thicker and coarser meanwhile the formation of Cu - Sn compounds could be found in interface layer. Accordingly, the shear strength of the joints decreased significantly, and decreased to 40.65% of its original value till 1000 h. And the britde fracture features of brazed joint shear fracture surface were increased during the aging treatment.
出处
《电子工艺技术》
2009年第2期70-73,共4页
Electronics Process Technology
基金
陕西省自然科学研究计划资助项目(项目编号:2002E111)
关键词
无铅焊料
界面形貌
剪切性能
时效处理
Lead - free solder
Interracial morphology
Shear property
Aging treatment
