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Ni-W-P合金电镀液中钨的测定 被引量:1

Determination of Tungsten in Ni-W-P Alloy Electroplating Solution
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摘要 为了快速测定Ni-W-P合金电镀液中钨的含量,在酸性介质中,采用分光光度法研究了钨(Ⅵ)-苯芴酮(PF)-十六烷基三甲基溴化铵(CTMAB)三元配位物的吸光特性,探讨了电镀液中配位剂柠檬酸、还原剂次亚磷酸钠以及共存组分对钨含量测定的影响。结果表明:当电镀液中Ni2+,Fe3+,柠檬酸的浓度分别在W6+浓度的3,3,200倍以内时,对W6+浓度测定的影响可以忽略,次亚磷酸钠的浓度对W6+的测定没有影响。该测量方法快速、准确,适用于Ni-W-P合金电镀液中钨含量的测定。 In order to rap-idly determine the content of tungsten in Ni-W-P alloy electropla-ting solution, the absorption spectral characteristics of the ternary complex of tungsten (VI)- (9-phenyl-2,3,7-trihydroxy-6-fluo-rine)-cetyltrimethylammonium bromide [W (Ⅵ) -PF-CTMAB] was studied using spectrophotometric method in a hydrochloric acid medium. The influences of citric acid complexing agent, sodium hypophosphite reductant, and other coexistent metallic components in the electroplating solution on determination of tungsten contentwere investigated. Results show that at a concentration of below 3 times, 3 times, and 200 times of that of W6+,coexistent Ni2* and Fe3* and citric acid had little effect on determination of tungsten content, while the concentration of sodium hypophosphite was ir-relevant to the determination of tungsten content. The present method is rapid and accurate and can be readily used to determine tungsten content in Ni-W-P alloy electroplating solution.
出处 《材料保护》 CAS CSCD 北大核心 2009年第4期70-72,共3页 Materials Protection
关键词 成分测定 分光光度法 NI-W-P 合金电镀液 钨含量 determination spectrophotometry Ni-W-P alloy electroplating solution tungsten content
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