摘要
文章通过对便携式电子产品封装发展小型化趋势的分析,阐明了液态点胶材料的普及应用的必然性,进一步分析研究液态点胶技术,比较传统的针头式点胶系统和喷射式点胶系统,说明喷射式点胶系统的特性:高效、高可靠性(无接触)、低成本,并且结合Asymtek公司点胶设备和MEMS麦克风点胶封装技术的实际,分析研究关键工艺参数的影响,归纳无接触式点胶技术应用的一些关键技术工艺参数点,展望市场的前景,阐明未来点胶技术的发展必然趋势。
In this paper, author perform some trend analysis especially as for the size for portable electronics product： the size is keeping continuing shrinking. Also perform some comparison study between traditional needle dispensing technology and newly developed jetting-noncontact dispensing technology. The mainly advantage of jetting-noncontact dispensing technology ： higher productivity, higher reliability and low cost. Also provide some process parameter analysis based on dispensing application on MEMS microphone. Point out that noncontact dispensing is the trend of dispensing technology.
出处
《电子与封装》
2009年第6期5-8,共4页
Electronics & Packaging
关键词
液态点胶
喷射式点胶
无接式触点胶
liquid dispensing technology
jetting dispensing technology
noncontact dispensing technology
