摘要
根据ASTM E8M-04标准,对两种无铅焊料91.5Sn8.5Sb和95.5Sn3.8Ag0.7Cu分别在15℃、75℃、150℃温度下和10-5s^10-2s十种应变速率下进行了一系列恒定应变速率的拉伸试验。分析了这两种无铅焊料的粘塑性力学行为。实验表明这两种无铅焊料具有温度和应变速率相关性。采用统一型Anand粘塑性本构式,描述了这两种无铅焊料的非弹性率相关的变形行为,并基于非线性拟合程序确定了Anand粘塑性本构式的九个材料常数。结果表明Anand式能有效描述无铅焊料的粘塑性行为,可应用于电子封装无铅焊点的可靠性模拟和失效分析。
According to ASTM E 8M-04 standard,a series of tensile experiments of 91.5Sn8.5Sb and 95.5Sn3.8Ag0.7Cu solder alloy at 10 strain rates from 1E-5/s to 1E-2/s and at 3 temperatures 15℃,75℃ and 150℃ were conducted.Based on the experimental data the viscoplastic mechanical behavior of those materials was analyzed to reveal the strong dependence on both test temperature and strain rate.Anand model,a unified viscoplasticity model was employed to describe the nonlinear rate dependent deformation behavior of both Pb-free solder alloys,and the materials parameters of Anand model were determined based on the nonlinear fitting codes.It is concluded that the viscoplastic Anand law can be applied for representing the viscoplastic deformation behavior of Pb-free solder alloy at high homologous temperature.This viscoplastic law can be suggested for reliability simulation and failure analysis of Pb-free solder alloy in electronic packaging.
出处
《应用力学学报》
CAS
CSCD
北大核心
2009年第2期248-252,共5页
Chinese Journal of Applied Mechanics
基金
浙江省自然科学基金(Y107365)
关键词
Anand
本构模型
无铅焊料
粘塑性
Anand,constitutive model,Pb-free solder alloy,viscoplastic.
