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回流焊温度测试装置的设计

Design of Reflow Soldering temperature testing device
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摘要 针对如何提高焊接生产线的生产质量,降低PCB的报废率,设计了一种回流焊温度测试装置。该装置采用了热电偶数字转换器芯片MAX6675,该芯片具有信号放大、冷端补偿、A/D转换和断偶检测等功能,在满足精度的基础上大大简化了设计。采用单块89s52单片机做主控芯片,并外扩了铁电体存储器,通过USB通信方式与上位机进行数据传送。实践表明:该装置的应用能够促进焊接生产线的生产工艺的不断优化,从而大大提高了焊接生产线的焊接效率,降低了生产成本。 In order to improve the quality of the Weld production lines and reduce the PCB scrap,this text designs a Reflow Soldering temperature testing device.The device adopts the thermocouple digital converter chip MAX6675,which integrates the signal amplifier,cold-compensation,A / D conversion and detection feature of breaking.so,the design has been greatly simplified on the basis of meeting the accurracy.the device is controlled by a single chip computer 89S52,And has expanded the FRAM outside,then the data is transmitted to upper computer through the USB interface.the application shows the use of the device will retrofit the technology of the Weld production lines unceasingly,so,the weld efficiency of the Weld production lines could be improved and the producing cost could be cut down.
出处 《微计算机信息》 2009年第20期235-236,共2页 Control & Automation
关键词 回流焊 K型热电偶 MAX6675 USB Reflow Soldering K-thermocouple MAX6675 USB
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