摘要
简要地介绍了电子产品热分析、热设计的重要性及其方法的发展。重点介绍基于TASPCB环境下的电子元器件热模型的建立方法和电子元器件热功耗评估技术,并给出典型PCB热设计的实例,提出电子产品PCB设计的热设计优化措施。
In this paper, the importance and advances of thermal analysis and thermal design of electronics were generally introduced. The thermal modeling and dissipation evaluation of electronic components based on TASPCB environment were presented in detail. A typical example for PCB thermal design was given, and the measures for optimizing the thermal design of PCBs were offered.
出处
《电子产品可靠性与环境试验》
2009年第4期42-48,共7页
Electronic Product Reliability and Environmental Testing
关键词
印刷电路板
热模型
热功耗
热设计
PCB
thermal model
thermal dissipation
thermal design
