摘要
依据电位活化理论，研究了超低浓度焦磷酸铜预镀铜电解液，其组成为：0．5～2．5g/L焦磷酸铜，150-200g／L焦磷酸钾。在该电解液中的阴极钢铁件主要发生水的电解反应，同时，工件表面的氧化膜被还原。经过上述处理后，工件表面镀上一层铜膜，然后按常规焦磷酸盐工艺镀铜。实验表明。镀层与基体的结合力与钢铁件氰化镀铜大体相同。
An ultra-low concentration copper pyrophosphate electrolyte for preliminary copper plating, which contained 0.5-2.5 g/L Cu2P2O7·3H2O and 150-200 g/L K4P2O7·3H2O, was researched according to the potential activation theory. A water electrolysis reaction was took place on the cathodic steel workpiece, and the oxide film on the steel workpiece surface was reduced. Treated by above process, the workpiece was coated with a copper film and then could be copper plated with conventional pyrophosphate copper-plating bath. The tests show that the bonding strength of the eleetroplating layer on steel substrate is similar to that of cyanide copper plating on steel surface.
出处
《电镀与精饰》
CAS
北大核心
2009年第8期11-14,共4页
Plating & Finishing
关键词
电位活化
钢铁件
超低浓度
焦磷酸铜
预镀铜
potential activation
steel workpiece
ultra-low concentration
copper pyrophosphate
preliminary copper plating
