摘要
焊膏是焊料合金粉末与助焊剂的混合物,其质量的优劣对印刷效果有极其重要的影响,特别是无铅化工艺中。介绍了焊膏的组成、主要性能要求及其影响因素,对目前常用的焊料合金和助焊剂的性能和使用效果进行总结,并对不同行业所适用的焊膏类型进行了论述。
Solder paste is a compound of solder alloy and flux, and its quality affects printing the main factors that infect the performance of solder paste are introduced. The performance of different solder and flux which in common use at present are contrasted. Some suggestions about the selection of lead - free solder paste in PCB assembly are provided.
出处
《电子工艺技术》
2009年第5期270-273,共4页
Electronics Process Technology
关键词
无铅化
焊膏
焊料合金
助焊剂
Lead - free
Solder paste
Solder alloy
Flux
