摘要
高密度PCB板的微细孔加工普遍采用激光加工微孔,但PCB板中铜箔对CO2激光的反射率高,会造成铜箔突起和裂纹,能量过小时又无法进行加工,若采用保型掩模加工技术,工艺较复杂.通过光致等离子体分析研究了提高铜箔对激光能量吸收的方法,实验表明:该方法不仅可简化加工步骤,还可进一步提高加工效率.
Microvia manufacture on HD-PCB is one of the important techniques in microelectronics manufacture.With laser drilling via the efficiency have improved.The copper foil in PCB has high reflectivity for CO2 laser and will make copper foil protuberance and crack and low energy can＇t hold the drilling process.And the conformal mask laser drilling method will make technologies complex.This paper studies the method to improve absorptivity for copper foil through photo-plasma.The test results show that the method will simplify process steps and improve efficency.
出处
《广西工学院学报》
CAS
2010年第1期65-67,共3页
Journal of Guangxi University of Technology
基金
广西区自然科学基金(桂科自04810091)资助
