摘要
将稀土相ErSn3分别暴露于空气与真空环境中,研究在时效处理过程中ErSn3表面Sn晶须的生长情况。结果表明:大气环境中,在稀土相ErSn3的表面出现了Sn晶须的生长现象,且室温条件下Sn晶须的分布不均,生长速度慢,而高温条件下Sn晶须的分布均匀,生长速度快;真空环境中,在稀土相ErSn3的表面未出现Sn晶须的生长现象。由于在大气环境中稀土相ErSn3发生了氧化,氧原子向ErSn3晶格内部的扩散引起的体积膨胀提供了Sn晶须生长的驱动力,因此,大气环境中在ErSn3的表面会出现Sn晶须的生长现象,而真空环境中则不会出现。
Tin whisker growth on the surface of ErSn3 phase was investigated during air and vacuum aging of ErSn3,respectively.The results indicate that tin whisker growth occurs on the surface of the oxidized ErSn3 phase during air aging.Moreover,the growth rate is slow and the distribution is uneven during room temperature aging;on the contrary,the growth rate of tin whiskers is fast and the distribution is even during 150 oC aging;however,no tin whisker is found on the surface of ErSn3 phase during vacuum aging.The volume expansion which is caused by diffusion of oxygen atoms into ErSn3 lattice during oxidization in air produces compressive stress that provides the driving force for tin whisker growth;thus tin whisker growth happens during air aging and no whisker is found during vacuum aging.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2010年第8期1419-1422,共4页
Rare Metal Materials and Engineering
基金
"十一五"国家科技支撑重点项目(2006BAE03B02)
关键词
无铅钎料
稀土Er
SN晶须
lead-free solder
rare earth Er
tin whiskers
