摘要
采用配方为硫酸铜3 g/L、酒石酸钾钠25 g/L、甲醛（质量分数为36%-40%）10 g/L、氢氧化钠7 g/L的镀液,通过考察施镀温度、镀液pH值、施镀时间对镀速的影响,确定了最优工艺参数,并在优化的工艺条件下制备镀层,用扫描电镜和能谱仪对镀层的形貌及成分进行了分析。结果表明：最佳工艺是镀液温度50℃,pH=12,施镀时间45-50 min;采用此优化工艺条件制备的镀层,表观光亮、均匀,与基体结合力好,成分为单一的铜。
With the bath formula（CuSO4 3 g/L,methanal 10 g/L,potassium sodium tartrate 25 g/L and NaOH 7 g/L）,the influences of the temperature,pH value and plating time on the plating copper quality were discussed.The optimal process parameters were determined and the coating was obtained under the excellent conditions.The surface morphology and components of the coating were studied by SEM and EDS.The results show that the optimum operating condition is temperature being 50 ℃,the optimum pH value being 12 and plating time being 45～50 min.The deposits obtained under the optimal technical conditions is smooth,uniformity and has the better adhesion between the deposits and the substrate.The analyses of energy disperse X-ray indicate that the single content is copper in the deposits.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2010年第5期77-79,114,共4页
Surface Technology
基金
河南科技大学青年科学研究基金(2007QN007)
关键词
化学镀铜
PP塑料
工艺
沉积速率
electroless copper plating
polypropylene
process
deposition rate
