摘要
使用常规、微观电镜、动力相图和统计时频分析等方法,进行了引线键合机理的实验研究.通过对换能系统和劈刀振速的高频分量、键合压力的测试,以及键合界面微观结构的观察,建立了键合区域宏观受载等效模型,和对键合机理的框架认识.可作为键合过程优化的指导,和键合动力学建模的依据.
Wire bonding experiments were performed in a lab test-bed.Vibration behavior of bonder transducer and bonding pressure were monitored by Laser Doppler Vibrometer.For assessing wire bond quality,the bond lift-off microstructures were observed by scanning electron microscope as a post-effect evaluating for bonding process.Wavelet decomposing,combined with statistics-based data processing,was utilized to explore the details of bonding process.A macroscopical equivalent model for bonding area is developed based on the velocity vs.pressure phase portraits.The basic understanding on wire bonding can be used for identifying wire bonding dynamics and optimizing the machine set-ups.
出处
《电子学报》
EI
CAS
CSCD
北大核心
2010年第11期2697-2703,共7页
Acta Electronica Sinica
基金
国家重点基础研究发展计划项目(No.2009CB724203)
02重大专项"高密度三维系统级封装的关键技术研究"(No.2009ZX02038)
关键词
引线键合
非线性动力学
多普勒测速
小波时频分解
动力相图
wire bonding
nonlinear dynamics
LDV sensing
wavelet time-frequency decomposing
dynamical phase portrait
