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甲基磺酸盐镀锡稳定剂的研究 被引量:1

Study on stabilizer for methanesulfonate tin plating
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摘要 在含有Sn2+90g/L、甲基磺酸120g/L、OP乳化剂10mL/L、光亮剂12mL/L的基础镀锡液中,通过加速氧化实验,确定了最佳稳定剂组成为:抗坏血酸2g/L,三氯化钛0.1g/L。结果表明,稳定剂与光亮剂具有协同作用,稳定剂使镀液的分散能力、光亮电流密度范围、锡析出过电位略有提高,电流效率提高1.14%以上。同时,稳定剂能提高镀层的可焊性、致密性和耐蚀性,对镀层纯度无明显影响。 The optimal stabilizer composition for a basic solution composed of Sn^2+ 90 g/L, methanesulfonic acid 120 g/L, OP emulsifier 10 mL/L and brightener 12 mL/L was determined by accelerated oxidation experiment as follows: ascorbic acid 2 g/L and titanium trichloride 0.1 g/L. The results showed that the stabilizer and brightener have synergistic effect. The throwing power of bath, the current density range for bright deposit and the cathode overpotential of tin electrodeposition are slightly improved and the current efficiency is improved by 1.14% after the addition of stabilizer. The weldability, compactness and corrosion resistance of deposit are also improved while the purity of deposit is not significantly affected.
出处 《电镀与涂饰》 CAS CSCD 北大核心 2011年第1期6-9,共4页 Electroplating & Finishing
关键词 电镀锡 稳定剂 甲基磺酸盐 抗氧化能力 tin electroplating stabilizer methanesulfonate oxidation resistance
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