摘要
铜粉导电胶粘剂的发展对电子技术的发展有着非常重要的意义。介绍了铜粉导电胶的分类、组成及铜粉导电胶的研究现状,综述了铜粉导电胶在电学性能、力学性能、老化性能等方面的研究进展。最后对铜粉导电胶存在的问题及其今后的研究方向进行了展望。
The development of copper conductive adhesive has great importance in the development of electronic technique. In the paper, the constitution, classes and recent advances in the research on copper conductive adhesive were briefly introduced. The research progress of electrical performance, mechanics performance and ageing performance for copper conductive adhesive were summarized. It also presented the problems of copper conductive adhesive and the prospect ofresearch direction.
出处
《广东化工》
CAS
2011年第1期84-86,共3页
Guangdong Chemical Industry
基金
2009年湖南省科技计划项目(2009GK3122)
关键词
铜粉导电胶
组成
导电性
研究现状
copper conductive adhesive
composition
conductivity
research progress
