摘要
A 3D t＇mite element model of the explosive welding process of three-layer plates with materials of steel-copper-copper is es- tablished. Based on the presented model, the bonding mechanism is simulated and analyzed, different detonation modes are also comparatively studied to indicate the driving force spread in few microseconds. The results show that the three layer plates bond together after many times of impact between the flyers and the base driven by detonation wave, which is damping rapidly at each impact with wavelength decreasing. The pressure at the detonation point is minimal, which induces non-bonding of the plates here. Detonation wave propagates in concentric circle both under side-midpoint detonation mode and under center-point detonation mode, but the movement of the flyer is different, which makes non-bonding easily occur at the end of detonation under side-midpoint detonation and at the center of the plate under center-point detonation.
A 3D finite element model of the explosive welding process of three-layer plates with materials of steel-copper-copper is established. Based on the presented model, the bonding mechanism is simulated and analyzed, different detonation modes are also comparatively studied to indicate the driving force spread in few microseconds. The results show that the three layer plates bond together after many times of impact between the flyers and the base driven by detonation wave, which is damping rapidly at each impact with wavelength decreasing. The pressure at the detonation point is minimal, which induces non-bonding of the plates here. Detonation wave propagates in concentric circle both under side-midpoint detonation mode and under center-point detonation mode, but the movement of the flyer is different, which makes non-bonding easily occur at the end of detonation under side-midpoint detonation and at the center of the plate under center-point detonation.
基金
supported by the State Key Laboratory of Solidification Processing in Northwestern Polytechnical University (Grant No. SKLSP200906 )
111 Project (Grant No. B08040)
