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低粘度苯并噁嗪树脂的制备与固化 被引量:4

Preparation and Curing of Low-viscosity Benzoxazine Resin
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摘要 以分子量为230、400和2000的聚醚胺与苯酚和多聚甲醛反应合成了聚醚胺型苯并噁嗪(PEDA-BZ),用红外光谱(FT-IR)、凝胶渗透色谱仪(GPC)和粘度仪分别表征合成的苯并噁嗪,将其与传统的单官能度和双官能度苯并噁嗪(PAF和BAF)以不同比例共混,采用差示扫描量热法(DSC)测试不同升温速率下苯并噁嗪树脂的固化行为,利用Kissinger方程计算树脂固化反应的表观活化能。结果表明:共混树脂的电阻率达108Ω·cm以上;共混树脂的固化活化能较高,且分子量最高的聚醚胺型苯并噁嗪的固化反应活化能最高。 Polyether diamine-based benzoxazine(PEDA-BZ) precursors were prepared from diamionalkoxy with molecular weight of 230,400 and 2 000,phenol and paraformaldehyde,and characterized by Fourier transform infrared spectroscopy(FT-IR),Gel permeability chromatography(GPC) and viscometer.The PEDA-BZ precursors were mixed with typical mono-functional(PAF) and dual-functional benzaoxines(BAF) with different proportion and the electric property of cured benzoxazine blends were studied.The curing behavior of the benzoxazines was studied by differential scanning calorimeter(DSC) at different heating rate.The apparent activation energy(Ea) of curing reaction of the benzoxazines was evaluated according to Kissinger's equation.Results indicate that the resistivity of the blends is more than 108 Ω·cm.The Ea of benzoxazine blend is higher than that of pure benzoxazine,and Ea of PEDA-BZ with molecular weight of 2 000 is the highest.
出处 《绝缘材料》 CAS 北大核心 2011年第2期13-16,共4页 Insulating Materials
关键词 苯并噁嗪 聚醚胺 低粘度 电性能 固化动力学 benzoxazine diamionalkoxy low viscosity electric property curing kinetics
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